Residual Stress in Glass Layer Coated on Ceramic Substrate
نویسندگان
چکیده
منابع مشابه
Residual Stress in Cu Sputtered Films on Glass Substrates at Different Substrate Temperatures
Copper films of 300 nm thickness deposited by planar magnetron sputtering on glass substrates, for substrate temperatures between 300 and 500 K, and deposition rate of 10 ?s?1. Microstructure of these films was obtained by X-ray diffraction, while the texture mode of diffractometer was used for stress measurement by the sin2? technique. The components of the stress tensor are obtained using mea...
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copper films of 300 nm thickness deposited by planar magnetron sputtering on glass substrates, for substrate temperatures between 300 and 500 k, and deposition rate of 10 ?s?1. microstructure of these films was obtained by x-ray diffraction, while the texture mode of diffractometer was used for stress measurement by the sin2? technique. the components of the stress tensor are obtained using mea...
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ژورنال
عنوان ژورنال: Journal of the Ceramic Society of Japan
سال: 1991
ISSN: 0914-5400,1882-1022
DOI: 10.2109/jcersj.99.448